SPECIFICATIONS (@ 25ºC AMBIENT)
- Heat Load Maximum: 250 Watts
- Thermal Resistance R (th): 0.059 K/W
- Laser Diode Mounting Area: 100mm x 140mm
- Laser Diode Package Footprint (pre-drilled holes): Customer Specified
- Temperature Uniformity: < 0.5ºC Across Mounting Plate Surface
- Laser Diode Mounting Plate Surface Flatness: < 10 µm
- Dual Fans Power Requirement: 2 x 24 VDC (14 Watts)
- Dual Fans Maximum Noise: 53 dB
COMPATIBLE LASER DIODE PACKAGE STYLES
- Submit Your Laser Diode PDF Data Sheet to Receive the Mounting Plate Part Number
- Standard Mounting Plates Available for Most Fiber Coupled Package Styles
- Custom Mounting Plates Available on Request
COOLING CAPACITY RELATIVE TO AMBIENT TEMPERATURE
- Ambient Temperature 20°C ... Waste Heat Removal 250 Watts
- Ambient Temperature 25°C ... Waste Heat Removal 170 Watts
- Ambient Temperature 30°C ... Waste Heat Removal 90 Watts
250W High Power Laser Diode Heat Sink and Mount; Fan Cooled
Key Features
- Pre-Configured Mounting Plate for your Laser Package Type Available
- Thermal Resistance R (th): 0.059 K/W
- Laser Diode Waste Heat Removal of 250 Watts at Ambient / Lab Temperature of 20°C
Shipping Information
– Shipping rates in the USA: $39.50
– Please contact us for International Shipping Rates
Order Placement
Orders for this product in North America and select International Regions are processed and fulfilled by LaserDiodeControl.com, part of the Laser Lab Source Marketplace Group. This product is manufactured by Ostech, GmbH. Mfg Part Number: hsp-250-1616-v0-656
Warranty Information
This product is sold with a full one year warranty. It is warrantied to be free from defects in material and/or workmanship for a period of one year from the date of shipment. The warranty is transacted and honored by Laser Lab Source for product purchases made through Laser Lab Source.
Weight |
1 lbs |
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Dimensions |
10 × 8 × 6 in |
|
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Heat Sinks |
250 W max heat load |
Product Overview
250 Watt Laser Diode Mount & Heat Sink Overview
The LDM-250W high power laser diode heat sink and mount is a high-performance cooling solution designed for fiber coupled and free-space laser diode packages. It is an “all-air” cooling design. The heat from the laser diode is pumped through the laser mounting plate and is removed from the assembly through the fan located in the base.
Fan Cooled Heat Sink
The heat emitted from the laser diode is conducted down through the laser mounting plate through a low thermal impedance plate surface. Two high CFM fans located in the base dissipate the heat from the base of the block into the air. The LDM-250W offers a low thermal impedance of < 0.059 K/W mounting surface for the laser being tested. Thermal performance of a heat sink is highly dependent on the thermal impedance, or resistance. This measurement is defined in units of degrees Celsius per watt of heat°C/W. The thermal resistance allows the user to determine the amount of temperature rise that the laser diode will experience for each watt of thermal energy that is emitted by the device under test. The dual fans in the base greatly improve the thermal performance of the heat sink and allow the user to set the laser temperature to a set-point which is equivalent to the lab ambient temperature. Careful machining of the mounting plate surface finish and surface flatness are also crucial to the heat sink performance.