Integrated TE / Peltier Cooler Under Mounting Plate and 10 kΩ Thermistor
Mounting Plate can be Pre-Configured for your Laser Diode Package
Mounting Plate Thermal Resistance R (th): < 0.06 K/W
Shipping Information
– Shipping rates in the USA: $39.50
– Please contact us for International Shipping Rates
Order Placement
Orders for this product in North America and select International Regions are processed and fulfilled by LaserDiodeControl.com, part of the Laser Lab Source Marketplace Group. This product is manufactured by Ostech, GmbH. Mfg Part Number: hsa-38-0610-v0-649
Warranty Information
This product is sold with a full one year warranty. It is warrantied to be free from defects in material and/or workmanship for a period of one year from the date of shipment. The warranty is transacted and honored by Laser Lab Source for product purchases made through Laser Lab Source.
The LDM-50W is an actively cooled heat sink which utilizes a Peltier TEC element embedded beneath the laser mounting plate as well as a fan in the base of the cooling block. The heat from the laser diode is pumped through the TEC to the heatsink at the base of the cooling block. The fan located in the base dissipates the heat from the base of the cooling block. These Peltier / TEC-cooled mounts provide high performance heat removal and temperature stabilization for the pump laser diode. Standard mounting plates are available for most fiber coupled package styles, and custom plates are available.
Laser Diode Mount & Heat Sink Key Features
The heat sink and mounting modules offer a temperature control range of +10 °C to 45 °C and can dissipate up to 50 watts of waste heat at a lab temperature of 25 °C. The mount includes a 15-pin D-Sub connector, wired for the built-in TEC, temperature sensor, and the fan in the base. The connector also includes pre-wired Anode and Cathode leads for the laser package.
Laser Diode Mount & Heat Sink Thermal Conductivity
The LDM-50W offers a low thermal impedance of < 0.06 K/W. The surface of the mounting plate is machined with micron level surface flatness and finish tolerances. These units ship with a graphite thermal mounting pad which can be placed under the laser to increase thermal conductivity to the mounting plate. The graphite pad is slightly flexible so that small particulates or dust don’t inhibit the thermal conductivity path. These features combine to provide a very low thermal resistance between the laser and the TEC controlled mounting plate.
