Shipping Rates:
– Shipping is $25 for orders shipped to addresses in the USA.
– Please contact us for shipping rates to other regions.
Order Placement
Sold & Supported in North America by LaserDiodeSource.com
Orders for this product are processed and fulfilled by Laser Lab Source, the marketplace for Laser Scientists and Engineers. This item ships from Bozeman, MT USA.
Warranty Information
This product is sold with a full one year warranty. It is warrantied to be free from defects in material and/or workmanship for a period of one year from the date of shipment. The warranty is transacted and honored by Laser Lab Source for product purchases made through Laser Lab Source.
High Efficiency Laser Diode Heatpipe-Heatsink-Fan Assembly
The HS-008 is an affordable, high quality, versatile integrated heatsink and fan assembly, designed for maximum flexibility across a wide range of applications in your laser diode test lab and prototype shop. The mounting plate is nickel-plated for durability and improved heat conduction. Heatpipes are soldered into the nickel-plated mounting plate to minimize thermal spreading resistance, distribute the heat across the heatsink, and minimize efficiency-robbing thermal hot spots. To protect the surface until you’re ready to use it, the mount ships with a protective film over the mounting plate.
The HS-008 is a very affordable solution for a wide range of situations where a fully integrated thermoelectric cooled mount is overkill or over-budget. The HS-008 is perfect when high amounts of heat must be conducted away from the test device, but precision temperature control of the device is not required. The HS-008 provides laser heat dissipation capacity of 150 Watts with 12ºC temperature rise (12 ºC without TECs, 0ºC rise with optimized TECs).
The HS-008 heatsink is ideal for a wide variety of fiber-coupled laser packages and modules, IGBTs, high-heat test loads, and the like.
Low Thermal Resistance for High Heat-Flux Diode Laser Devices
Heatpipes are used in the HS-008 to maximize conduction of heat from the load to the heatsink and improve overall efficiency by reducing local hot-spots on the mounting plate. The fins on the heatsink are designed to break up laminar airflow, which improves heat dissipation efficiency, as well. Finally, the high fin-density heatsink is enclosed in a sheet metal duct to direct the entire volume of forced air over the fins, thereby providing the low thermal resistance of 0.08 ºC/W. This low thermal resistance means that for every 10 Watts of power input to the heat-sink mounting plate, the temperature of the heatsink surface will rise 0.8ºC.
Customizable Options for Maximum Versatility and Ease-of-Use
All heatsink modules can be ordered with an optional IP68 fan for operating in harsh dust and liquid environments. Also, custom mounting pre-drilled hole patterns are available from the manufacturer. Contact us for details and a quote.
